BLOG

14

2022-10

How to adjust the temperature rise and fall in a vacuum bidirectional pressurized sintering furnace

Category:


【Summary Description】Mastering precise temperature control is key to determining the optimal sintering temperature range. To assess whether you’re achieving proper combustion or avoiding overheating, refer to the electrical performance parameters of your vacuum double-action pressure sintering furnace. Now, let’s explore together how to adjust the heating and cooling rates on this advanced furnace!

  Many people are focusing on the actual peak temperature when it comes to the temperature control points of the vacuum dual-pressure sintering furnace. Vacuum Dual-Direction Pressurized Sintering Furnace Within the temperature range, temperatures that are too high are considered overfiring, while those that are too low are classified as underfiring—neither scenario leads to optimal sintering results. Therefore, mastering precise temperature control is key to identifying and maintaining the ideal sintering temperature range. To determine whether you’re dealing with insufficient or excessive firing, refer to the electrical performance parameters of your vacuum double-pressure sintering furnace. Now, let’s explore together how to adjust the furnace’s temperature ramp-up and ramp-down settings!

 How to adjust the temperature rise and fall in a vacuum bidirectional pressurized sintering furnace

  If sintering is insufficient and residual through-glass silver paste remains, less silver paste will penetrate into the n-type layer, resulting in poor ohmic contact and increased series resistance. Conversely, over-sintering leads to higher-than-usual silver consumption, while also causing the formation of a silver-silicon interfacial layer that creates additional resistance, further exacerbating the series connection's overall impedance. Therefore, resistance alone cannot reliably indicate whether the issue stems from under-sintering or over-sintering.

  If you're unable to determine the sintering status, adjust the temperature in Zone 8 to identify a rough adjustment point, then fine-tune gradually. During fine-tuning, base your decisions on the condition of the rear section. If the rear section shows slight expansion—indicating potential overheating—make precise adjustments to lower the temperature. Before starting the sintering process, ensure that all heating lamps are functioning properly. Also, verify that the power output of the lamps in each temperature zone isn’t significantly higher than the average for the other zones, ensuring uniform heating across the system. Vacuum Dual-Direction Pressurized Sintering Furnace It is a device that uses high-temperature heating to shrink the shape of objects or materials. By reducing the voids within the material, it gradually brings grain boundaries closer together and progressively bonds solid particles, thereby increasing density and producing a dense, sintered polycrystalline structure in the object.

  How should a vacuum double-action pressurized sintering furnace be maintained on a regular basis?

  1. Ensure that the equipment import/export warehouse and the transmission warehouse are kept clean and free of debris.

  2. Use the drain outlet to clean, and wipe away any organic matter on top with alcohol.

  3. Inside the cavity, primarily check whether all vent holes are clear of blockages.

  4. If the fluorescent tube has organic matter, it can be cleaned by wiping with non-woven fabric or alcohol-soaked cotton pads.

  5. If it's a diagonal mesh belt, you can slide it along while heating and softening the 120-degree section, then carefully remove it afterward.

  6. When working with the mesh, you can gently sand it using sandpaper to avoid damaging the solar cells.

   Vacuum Dual-Direction Pressurized Sintering Furnace Primarily used in the sintering processes for semiconductor components and power rectification devices, this equipment supports vacuum sintering, gas-protected sintering, and conventional sintering methods. It represents a cutting-edge addition to the family of semiconductor-specific equipment, featuring innovative design concepts, user-friendly operation, and a compact, space-efficient structure. With its versatile capabilities, a single unit can seamlessly handle multiple process steps, while also being adaptable for other applications such as vacuum heat treatment and vacuum brazing in various industries.

Related content